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HTSD-100Themal Shock Test Chamber

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  • 廣東宏展科技有限公司
  • 2017-12-10 09:33:18
  • 蘇州市
  • 東莞
  • 1216
  • 13634112423QQ:2856177234

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The two-zone thermal shock chambers have been developed to meet major International standards for thermal shock testing

【詳細(xì)說明】

Themal Shock Test Chamber HTSD-100

About

Uniform thermal stress performances

The two-zone thermal shock chambers have been developed to meet major International standards for thermal shock testing.
Achieving uniform thermal stress and outstanding temperature distribution performances, the 100L test area fits for a wide range of applications in the research and development, inspection or production field.

 
Meeting International Standards

The TSD chamber achieves various tests from major international standards such as MIL, IEC, JIS.

Reduced power consumption

Energy saving is a great matter for us. The TSD chamber integrates many features, such as a refrigeration capacity control, to reduce the power consumption by 30%.

Specifications
Model Temperature range Inside / Outside dimensions (mm)
TSD-100 High temp. exposure: +60 to +200°C [+140 to +392°F]
Low temp. exposure: -65 to 0°C [-85 to +32°F]
W710xH345xD410 / W1100xH1885xD1965

 

Features

  • Short temperature recovery time
    The two temperature zone system achieves quick specimen temperature recovery time (less than 15 min. for 10kg of ICs, at extreme temperature exposure).
  • Excellent temperature uniformity
    ESPEC improved its chamber temperature uniformity of 30% compared to previous model, thus leading to minimum variations among specimens, and more reliable test results.
  • STT function (Specimen Temperature Trigger)
    The TSD-100 features a STT function, monitoring the specimen to launch the exposure time or going on to following step during test. Overall test duration is reduced by eliminating pretest procedures and temperature is attained with even more accuracy.
  • Ambient temperature recovery feature
    Outside air is introduced into the test area after test is complete, to quickly restore an ambient temperature and remove specimens safely.
  • Specimen temperature recovery (example)
    (based on MIL-883 condition C)
    Test conditions
    High temp. exposure: +155°C for 30 min.
    Low temp. exposure: -68°C for 30 min.
    Specimens: ICs, 10 kg
    Temperature uniformity measurement method
    Thermocouples were embedded in 10 ICs placed on two levels in each of the corners and in the center of a specimen basket. (Specimens with embedded thermocouples were placed beneath other ICs.)
  • Temperature uniformity performance (example)
    Test conditions
    High temp. exposure: +150°C for 30 min.
    Low temp. exposure: -65°C for 30 min.
    Specimens: ICs (×10)
    Temperature uniformity measurement method
    Thermocouples were attached to the surface of 10 ICs placed on two levels in each of the corners and in the center of a specimen basket.

    Test time comparison (example)
    Test conditions
    High temp. exposure: +150°C, 15 min. after recovery
    Low temp. exposure: -65°C, 15 min. after recovery
    Specimens: ICs, 10kg
    Control points: Upstream of sensor positions
    Measurements
    Test time reductions of approximay 15 minutes per cycle compared to other ESPEC models. For 3,000 cycles testing this cuts previous test times from 4.5 months to approximay 1 month.

Tset Standards

Compatible test standards

IEC 60749-25 : Semiconductor devices – Temperature cycling
IEC 60068-2-14 Na : Environmental testing – Change of temperature
IEC 61747-5 Na : Liquid crystal and solid-state display devices – Environmental, endurance and mechanical test methods
MIL-STD-202G : Test method standard – Electronic and electrical component parts
MIL-STD-883F : Military standard, microcircuits, test standards
IPC-TM-650 2.6.6 : Temperature cycling, printed wiring board
SAE J1879 : Handbook for robustness validation of semiconductor devices in automotive applications
JASO-D001 : General rules of environmental testing methods for automotive electronic equipment
JASO-D902 : Durability testing methods for automotive electronic equipment
EIAJ ED-4701 : Environmental and endurance test methods for semiconductor devices. (General)
EIAJ ED-4702 : Mechanical stress test methods for semiconductor surface mounting devices
EIAJ ED-7407 : Environmental and endurance test methods for CSP, BGA package on mounting condition

Options

  • Paperless recorder
  • Temperature recorder (digital)
  • Recorder terminal
  • STT 3-point Expansion
  • Specimen temperature measuring thermocouple
  • Total cycle counter
  • Additional cable port
  • Cable port rubber plug
  • Specimen basket/ shelf bracket
  • Chamber dew tray
  • External alarm terminal
  • Fixture for securing body
  • Communication cables
  • Viewing window
  • Exposure signal output
  • Temperature recorder for future installation
  • Heavy-duty shelves
  • Casters
  • Additional overheat protector
  • Emergency stop switch
  • Communication functions
  • Power cord
  • Additional overheat protector
  • Auxiliary cooling injector (LN2 or LCO2

Themal Shock Test Chamber HTSD-100

About

Uniform thermal stress performances

The two-zone thermal shock chambers have been developed to meet major International standards for thermal shock testing.
Achieving uniform thermal stress and outstanding temperature distribution performances, the 100L test area fits for a wide range of applications in the research and development, inspection or production field.

 
Meeting International Standards

The TSD chamber achieves various tests from major international standards such as MIL, IEC, JIS.

Reduced power consumption

Energy saving is a great matter for us. The TSD chamber integrates many features, such as a refrigeration capacity control, to reduce the power consumption by 30%.

Specifications
Model Temperature range Inside / Outside dimensions (mm)
TSD-100 High temp. exposure: +60 to +200°C [+140 to +392°F]
Low temp. exposure: -65 to 0°C [-85 to +32°F]
W710xH345xD410 / W1100xH1885xD1965

 

Features

  • Short temperature recovery time
    The two temperature zone system achieves quick specimen temperature recovery time (less than 15 min. for 10kg of ICs, at extreme temperature exposure).
  • Excellent temperature uniformity
    ESPEC improved its chamber temperature uniformity of 30% compared to previous model, thus leading to minimum variations among specimens, and more reliable test results.
  • STT function (Specimen Temperature Trigger)
    The TSD-100 features a STT function, monitoring the specimen to launch the exposure time or going on to following step during test. Overall test duration is reduced by eliminating pretest procedures and temperature is attained with even more accuracy.
  • Ambient temperature recovery feature
    Outside air is introduced into the test area after test is complete, to quickly restore an ambient temperature and remove specimens safely.
  • Specimen temperature recovery (example)
    (based on MIL-883 condition C)
    Test conditions
    High temp. exposure: +155°C for 30 min.
    Low temp. exposure: -68°C for 30 min.
    Specimens: ICs, 10 kg
    Temperature uniformity measurement method
    Thermocouples were embedded in 10 ICs placed on two levels in each of the corners and in the center of a specimen basket. (Specimens with embedded thermocouples were placed beneath other ICs.)
  • Temperature uniformity performance (example)
    Test conditions
    High temp. exposure: +150°C for 30 min.
    Low temp. exposure: -65°C for 30 min.
    Specimens: ICs (×10)
    Temperature uniformity measurement method
    Thermocouples were attached to the surface of 10 ICs placed on two levels in each of the corners and in the center of a specimen basket.

    Test time comparison (example)
    Test conditions
    High temp. exposure: +150°C, 15 min. after recovery
    Low temp. exposure: -65°C, 15 min. after recovery
    Specimens: ICs, 10kg
    Control points: Upstream of sensor positions
    Measurements
    Test time reductions of approximay 15 minutes per cycle compared to other ESPEC models. For 3,000 cycles testing this cuts previous test times from 4.5 months to approximay 1 month.

Tset Standards

Compatible test standards

IEC 60749-25 : Semiconductor devices – Temperature cycling
IEC 60068-2-14 Na : Environmental testing – Change of temperature
IEC 61747-5 Na : Liquid crystal and solid-state display devices – Environmental, endurance and mechanical test methods
MIL-STD-202G : Test method standard – Electronic and electrical component parts
MIL-STD-883F : Military standard, microcircuits, test standards
IPC-TM-650 2.6.6 : Temperature cycling, printed wiring board
SAE J1879 : Handbook for robustness validation of semiconductor devices in automotive applications
JASO-D001 : General rules of environmental testing methods for automotive electronic equipment
JASO-D902 : Durability testing methods for automotive electronic equipment
EIAJ ED-4701 : Environmental and endurance test methods for semiconductor devices. (General)
EIAJ ED-4702 : Mechanical stress test methods for semiconductor surface mounting devices
EIAJ ED-7407 : Environmental and endurance test methods for CSP, BGA package on mounting condition

Options

  • Paperless recorder
  • Temperature recorder (digital)
  • Recorder terminal
  • STT 3-point Expansion
  • Specimen temperature measuring thermocouple
  • Total cycle counter
  • Additional cable port
  • Cable port rubber plug
  • Specimen basket/ shelf bracket
  • Chamber dew tray
  • External alarm terminal
  • Fixture for securing body
  • Communication cables
  • Viewing window
  • Exposure signal output
  • Temperature recorder for future installation
  • Heavy-duty shelves
  • Casters
  • Additional overheat protector
  • Emergency stop switch
  • Communication functions
  • Power cord
  • Additional overheat protector
  • Auxiliary cooling injector (LN2 or LCO2

HTSD-100

About

Uniform thermal stress performances

The two-zone thermal shock chambers have been developed to meet major International standards for thermal shock testing.
Achieving uniform thermal stress and outstanding temperature distribution performances, the 100L test area fits for a wide range of applications in the research and development, inspection or production field.

 
Meeting International Standards

The TSD chamber achieves various tests from major international standards such as MIL, IEC, JIS.

Reduced power consumption

Energy saving is a great matter for us. The TSD chamber integrates many features, such as a refrigeration capacity control, to reduce the power consumption by 30%.

Specifications
Model Temperature range Inside / Outside dimensions (mm)
TSD-100 High temp. exposure: +60 to +200°C [+140 to +392°F]
Low temp. exposure: -65 to 0°C [-85 to +32°F]
W710xH345xD410 / W1100xH1885xD1965

 

Features

  • Short temperature recovery time
    The two temperature zone system achieves quick specimen temperature recovery time (less than 15 min. for 10kg of ICs, at extreme temperature exposure).
  • Excellent temperature uniformity
    ESPEC improved its chamber temperature uniformity of 30% compared to previous model, thus leading to minimum variations among specimens, and more reliable test results.
  • STT function (Specimen Temperature Trigger)
    The TSD-100 features a STT function, monitoring the specimen to launch the exposure time or going on to following step during test. Overall test duration is reduced by eliminating pretest procedures and temperature is attained with even more accuracy.
  • Ambient temperature recovery feature
    Outside air is introduced into the test area after test is complete, to quickly restore an ambient temperature and remove specimens safely.
  • Specimen temperature recovery (example)
    (based on MIL-883 condition C)
    Test conditions
    High temp. exposure: +155°C for 30 min.
    Low temp. exposure: -68°C for 30 min.
    Specimens: ICs, 10 kg
    Temperature uniformity measurement method
    Thermocouples were embedded in 10 ICs placed on two levels in each of the corners and in the center of a specimen basket. (Specimens with embedded thermocouples were placed beneath other ICs.)
  • Temperature uniformity performance (example)
    Test conditions
    High temp. exposure: +150°C for 30 min.
    Low temp. exposure: -65°C for 30 min.
    Specimens: ICs (×10)
    Temperature uniformity measurement method
    Thermocouples were attached to the surface of 10 ICs placed on two levels in each of the corners and in the center of a specimen basket.

    Test time comparison (example)
    Test conditions
    High temp. exposure: +150°C, 15 min. after recovery
    Low temp. exposure: -65°C, 15 min. after recovery
    Specimens: ICs, 10kg
    Control points: Upstream of sensor positions
    Measurements
    Test time reductions of approximay 15 minutes per cycle compared to other ESPEC models. For 3,000 cycles testing this cuts previous test times from 4.5 months to approximay 1 month.

Tset Standards

Compatible test standards

IEC 60749-25 : Semiconductor devices – Temperature cycling
IEC 60068-2-14 Na : Environmental testing – Change of temperature
IEC 61747-5 Na : Liquid crystal and solid-state display devices – Environmental, endurance and mechanical test methods
MIL-STD-202G : Test method standard – Electronic and electrical component parts
MIL-STD-883F : Military standard, microcircuits, test standards
IPC-TM-650 2.6.6 : Temperature cycling, printed wiring board
SAE J1879 : Handbook for robustness validation of semiconductor devices in automotive applications
JASO-D001 : General rules of environmental testing methods for automotive electronic equipment
JASO-D902 : Durability testing methods for automotive electronic equipment
EIAJ ED-4701 : Environmental and endurance test methods for semiconductor devices. (General)
EIAJ ED-4702 : Mechanical stress test methods for semiconductor surface mounting devices
EIAJ ED-7407 : Environmental and endurance test methods for CSP, BGA package on mounting condition

Options

  • Paperless recorder
  • Temperature recorder (digital)
  • Recorder terminal
  • STT 3-point Expansion
  • Specimen temperature measuring thermocouple
  • Total cycle counter
  • Additional cable port
  • Cable port rubber plug
  • Specimen basket/ shelf bracket
  • Chamber dew tray
  • External alarm terminal
  • Fixture for securing body
  • Communication cables
  • Viewing window
  • Exposure signal output
  • Temperature recorder for future installation
  • Heavy-duty shelves
  • Casters
  • Additional overheat protector
  • Emergency stop switch
  • Communication functions
  • Power cord
  • Additional overheat protector
  • Auxiliary cooling injector (LN2 or LCO2


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